The aim is to mimic the in-service conditions, verify the strength of adhesives and connections (solder joints), check the performance of finished components and validate new designs, and manufacturing processes.

The reliability of finished circuit boards, electronic assemblies and devices can be checked by subjecting them to appropriate thermo-mechanical fatigue cycles in tension, compression, shear or torsion. Also, high speed testing - including shock and impact - can be performed to guarantee the satisfactory performance of the devices.